Wafer Mapping Sensor M-DW1 - İstanbul Otomasyon Sistemleri
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Wafer Mapping Sensor M-DW1


he safe LED beam reflective type wafer mapping sensor

Wafer Mapping Sensor M-DW1
UL Recognaized CE Marking

UL , CE Approved
CE : EMC Directive
UL : Recognition

Features

Safe LEDs adopted

Conventional laser mapping sensor that adopts laser beam has been dangerous because an operator is exposed directly to laser beam, which comes out of the load port through FOUP. We have succeeded in developing LED to adopt as light source for M-DW1. Therefore an operator's safety is ensured.

Safe LEDs adopted

Sensing of nitride-coated wafers possible

Nitride-coated wafers absorb light at certain wavelengths depending on the coating thickness. If the sensor uses the laser beam having a single wavelength, the beam may be absorbed completely, resulting in wafer detection error. The M-DW1 uses a LED light source with a wide wavelength band that allows to detect nitride-coated wafers successfully.

High-speed response time: 0.5 ms

The sensor responds in 0.5 ms, meeting the requirements of both high speed and high accuracy in wafer detection.

Glass wafers are also detectable

The M-DW1, which detects wafers not by the light amount but by the light position, can detect the glass wafers regardless of the light amount.

Glass wafers are also detectable

Precise position detection by 2-segment receiving element

Wafer detection by the amount of reflected light may sometimes fail depending on the wafer edge shape. The M-DW1 uses 2-segment receiving element in the beam-receiving part, and detects wafers by the reflected light position instead of the amount of reflected light. Thus, the sensor is less affected by wafer thickness or the amount of reflected light.

Precise position detection by 2-segment receiving element

Compact and lightweight design with built-in amplifier

The sensor measures W80.6 mm x H18.3 mm x D50 mm W3.173 in x H0.720 in x D1.969 in, and weights only 75 g approx.

Compact and lightweight design with built-in amplifier

Title 2D CAD DATA 3D CAD DATA

M-DW1

Order guide

Model No. Appearance Center sensing distance Sensing object Output
M-DW1 45 mm 1.772 in 3 inch or larger semiconductor wafer NPN output / PNP output selectable by switch
Title 2D CAD DATA 3D CAD DATA

M-DW1



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